• Image 1
    Image 1
    3D Print Forming

    The world’s first sintered high volume additive

    Build high volume production parts using multiple materials:
    Ceramic, Metal, and Polymer Composites. Eliminate the need
    for assembly, highly adaptable, less time to market, and less tooling requirement.
  • Image 1
    Image 2
    Enabling Technology
    Innovative Designs
    Empowering creativity to produce superior parts
    Remove barriers of traditional manufacturing.
    Let your designers innovate for success.
    Create chambers, channels, holes, and vias using multiple co-fired materials.
  • Image 1
    Image 3
    Lower Cost
    Panel Processing
    Efficiently building up layers of multiple materials
    Rapid manufacturing of large panels containing envelope of parts.
    Thousands of parts could be produced simultaneously with no assembly required.
  • Image 1
    Image 4
    Green Process
    Additive Manufacturing
    No etching or plating necessary
    Eliminates the need for harsh chemicals which are bad for our environment.

Printed Lead Frame

Additive manufacturing revolutionizes semiconductor packaging— lower cost, improves performance, and ultra thin.

Read more

Shrinking IoT Devices

Multi-material 3D printing can integrate many basic components— improve performance, reduce form factor and power consumption.

Read more

3D Printed Fluidics

Multi-material 3D structure enables finer features and smaller footprint with highly scalable manufacturing – better than batch chemistry.

Read more

EoPlex Platform

EoPlex is the creator of an innovative deposition technique called 3D High Volume Print Forming (3DHVPF™) which is based on custom printing equipment and proprietary "inks" that allow it to produce low cost ceramic, metal, and polymer composites with engineered microstructure. This allows the manufacture of components with integrated chambers, channels, dielectrics, sensors, circuits, reactors, energy scavengers and other features. Many parts are created simultaneously in large panels and at low cost. A further advantage of the process is that it is additive and, as a result, is very environmentally friendly.


EoPlex Expands Semiconductor Packaging Business; New Malaysian Factory Plant Will Open in Q2 2012. (April 24, 2012)
EoPlex Announces Improved Lead Carrier Substrate that Enables a “Super QFN” Semiconductor Package (April 14, 2011)
3-D Printing Could Make Smartphone Chips Cheaper ieee Spectrum
(November 23, 2010)   pdf version