What does EoPlex do?
EoPlex has developed a unique multi-material additive printing technology capable of depositing metal and ceramic “inks.” Today, this technology is used for printing semiconductor packaging interconnect. The EoPlex Configurable Sintered Interconnect (CSI™) solution enables remarkable package designs, provides significant reductions in cost and size while improving thermal and electrical performance.
What’s so unique about CSI™?
Traditional additive or 3D printing technology has experienced its fair share of problems ranging from manufacturing speed to scalability issues. CSI™ is unique because it offers a new way to create interconnect for smaller, better performing QFN and other package types. The platform is suitable for high volume manufacturing environments and greatly simplifies the manufacturing process due to several facts: strip test ready by design, no de-flash or de-burring needed, no kapton tape, no etching or plating, and faster dicing. The technology is extremely flexible and adaptable to most the common packaging solutions on the market including QFP, QFN, BGA and even stacked and multi-die applications.
How does it work?
The CSI™ interconnect layer is very different from the conventional copper lead frame. Our technology is unique because the interconnect layer is 3D printed and sintered to form a solid structure suitable for gold and copper wire bonding. The process begins with a mold set on stainless steel, and filled with a proprietary material and later burned off. The sintered package components are then molded, and the steel carrier is easily peeled from the molded package, leaving behind a solder-ready surface.
What are the benefits?
The CSI™ platform yields thinner (< .25 mm), higher performance packages at a much lower price. It greatly simplifies the assembly and test process, removing costly and time consuming processes and materials.
Can you print other products?
Yes, but our primary focus is on semiconductor packaging interconnect. We recognize the value and importance of continual innovations and work with leading companies to discover, design, and develop new ways to utilize the 3D HVAM™ technology and CSI™ Platform. Some possible advanced devices include fuel cell components, energy harvesters, and more. EoPlex is currently accepting limited inquiries in these areas. Contact us directly for more information.
What is the cost savings between CSI-based QFN and a conventional lead frame QFN?
Contact usThe CSI™ interconnect layer is 3D printed and provides significant cost savings on material and process. The cost of a CSI™ interconnect layer is up to two times less costly than a conventional lead frame.
How thin can you make it? What is the lead count range?
The EoPlex CSI™ solution can produce interconnect layers as thin as 0.25 mm and range from 2 to more than 500 leads.
What happens to the steel carrier after peeling?
We recommend that the steel carriers be recycled, or disposed of at discretion of the customer.
How do we get started on a specific design or project?
For all inquiries, please contact us directly for more information.
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