EoPlex
Recruits Arthur L.
Chait as President
and CEO
Former Solectron Senior
Executive To Lead Component
Company
Redwood City, October 1, 2002 – EoPlex Technologies, Inc., the creator of a new class of components based on proprietary High Volume Print Forming (HVPF™), announced today that Arthur L. Chait has joined the company as President and CEO.
Chait was previously a senior executive of Solectron Corporation, a leading contract manufacturing firm, with revenues in excess of $12 Billion/year. Chait had responsibility for Solectron’s Global Account Organization, representing over 70% of the company’s revenue with customers including: Cisco, IBM, Nortel, Dell, Sun, HP, Compaq, Agilent, Ericsson, Lucent, Motorola, Apple, Intel and others. He also had worldwide responsibility for marketing and helped lead Solectron into new markets including: automotive, consumer electronics, and industrial. Chait was part of the senior team at Solectron that grew the company from $6.1 Billion in FY98 to $18.6 Billion in FY01.
Chait’s career also includes: SRI International where he was SVP of the worldwide consulting group with a staff of over 600; Zitel Corporation where he was GM and SVP of the software division; Booz Allen & Hamilton where he was Senior Engagement Manager; and Dresser/Halliburton where he was Director, Product Development. Chait serves on the Boards of Blue Iguana Networks and TechVenture Networks, and was past Board Chair of the Challenge Learning Center, a non-profit organization that assists “at risk” young people in the San Francisco bay area.
Charles Taylor, the founder of EoPlex and previously founder of CardioThoracic Systems said, “We’re thrilled to be able to attract someone like Art to head EoPlex. Art brings extensive general management skills, deep understanding of marketing and sales, and a hands on approach to technology development. Art has led and successfully grown technology based businesses and he has the vision and background to see the full potential of our revolutionary technology. Recruiting Art to EoPlex represents a major step forward for EoPlex and will give us the momentum to accelerate our growth in markets such as components for thermal management, sensors, microstructures, electronic/optical packaging and interconnects.”
About EoPlex
EoPlex Technologies, incorporated in 2001, is a private firm located in Redwood City that has developed proprietary systems for the production of commercial volumes of complex structures. The firm’s HVPF TM process allows it to create and mass produce complex 3D structures from combinations of metals, ceramics, and polymers for applications such as: thermal management, sensors, microstructures, medical devices, biosensors, and electronic/optical packaging.