EoPlex to Present on Bridge between Macro and Nano Technology at Norcal iMAPS Conference
Redwood City, CA – May 30, 2006 - EoPlex Technologies, Inc., the advanced materials company that produces complex 3-Dimentional structures through a new print forming technology, announced today that Philip Rogren will deliver a presentation to the Norcal Chapter of the International Microelectronics and Packaging Society (iMAPS). iMAPS is the key Northern California forum to explore issues and applications of microelectronics packaging. Rogren will be the featured speaker at the June 7 luncheon.
Rogren's presentation centers on a topic of ongoing relevance to the attendees gathering this year in Silicon Valley. "Three-Dimensional Print Forming: A Bridge Between Macro and Nano Technology" will address the increasing global demand for volume manufacture of small complex structures.
Rogren will describe manufacturing technology that applies layered deposition techniques, including screen printing, to produce very complex, 3-D structures in high volume. Developed with the standard materials and techniques of the microelectronics packaging industry, the technology is expanded to include a broad range of metallic, oxide and organic materials that can be used singly or in wide range combinations. Among the most important capabilities of the technology is the ability to incorporate precisely designed, open spaces, channels and cavities, either partially or completely enclosed, within the structure. The ability to produce true 3-D structures, including open spaces, combined with an expanded materials set, now opens potential applications to include micro-reactors, sensors, energy harvesters and thermal management systems, as well as microelectronics packaging. Rogren will show the techniques and capabilities of the technology, along with examples of current and potential applications.
About EoPlex Technologies, Inc.
EoPlex Technologies Inc. is a Redwood City, CA company that produces miniature, complex electronic and structural components and systems through new technology that captures the speed and flexibility of printing and applies it to manufacturing. The EoPlex print forming process allows the manufacture of miniature 3-D systems with high precision and low cost at any volume of production. EoPlex can manufacture components and systems from a wide range of metallic, ceramic, glass and polymer materials. Complex shapes such as 3-D grids, interwoven circuits, assemblies containing multiple parts, and multiple material structures can be produced at the same time. The EoPlex process makes it cost effective to mass produce products that would be difficult or impossible to manufacture using conventional techniques. Identified market applications include: micro-reactors, fuel cells, energy harvesting devices, sensors, electronic components, and thermal management. The company is backed by Labrador Ventures, Draper Fischer Jurvetson, and Draper-Richards. For more information, visit http://www.eoplex.com or call 650.361.9070. Media contact, Janice Odell at 707.237.2738 or email at jan@fordodell.com.