EoPlex Technologies, Inc. Raises $4.3M Series B
May 26, 2004 - EoPlex Technologies Inc., a manufacturing of miniature electronic components and subassemblies, closed a $4.3 million Series B on May 20, 2004. Labrador Ventures led the financing with investments from Draper Fisher Jurvetson and Draper-Richards.
“This financing allows EoPlex to create its first commercial scale prototype line to deliver prototype components to customers for qualification and to round out its management team,” said Arthur L. Chait, President, CEO and Chairman of EoPlex. “EoPlex is thrilled to be backed by a solid team of VCs like Labrador, DFJ and Draper-Richards who understand the potential of our approach,” added Chait.
“Labrador believes that EoPlex has extreme manufacturing advantages,” said Sean Foote, Labrador Ventures. “While most manufacturing costs scale with complexity, EoPlex's disruptive technology allows costs to scale with size. Thus, EoPlex is positioned to become a leader in the manufacture of small, complex metal, ceramic, and polymer components for industries ranging from wireless to semiconductor," added Foote.
“EoPlex fills the gap between the extremely small technologies like Nano/MEMs and the more conventional technologies like injection molding or LTCC,” said Alexei Andreev, Draper Fischer Jurvetson. “Their HVPFTM process appears to be the only technology that can build hybrid devices from metals and ceramics in the same structure with true 3-D designs and potentially in volumes high enough for applications like cell phones and consumer products,” added Andreev.
EoPlex has developed proprietary and patented methods for high volume production (High Volume Print-Forming™ or HVPF™) of three-dimensional structures from a wide range of metallic and non-metallic materials. Complex shapes such as three-dimensional grids, interwoven circuits, assemblies containing multiple parts, and multiple material structures can be produced at the same time. The EoPlex process makes it cost effective to mass-produce products, which would be difficult or impossible to manufacture using conventional techniques. Any shape that can be computer modeled or scanned can be produced using EoPlex processes. The greatest cost advantage, however, is with small structures similar in size to semiconductor packaging. Identified market applications include: electronic and optical packaging, electronic components, RF and microwave components, medical devices, unique 3-D circuits, fuel cells, batteries, mechanical components, switches, sensors and others.
EoPlex’s Board of Directors include: Sean Foote, Labrador Ventures; Alexei Andreev, Draper Fischer Jurvetson; Charles Taylor, Founder, EoPlex; and Arthur L. Chait, President and CEO, EoPlex.