EoPlex to Present on the Topic of Micro-Reactors in Fuel Cells at iMAPS Conference in Washington, DC
Redwood City, CA – May 1, 2006 -EoPlex Technologies, Inc. will present on the topic, "Print Forming Complex Micro-Reactors for Fuel Cell Applications," at the upcoming International Microelectronics and Packaging Society (iMAPS) conference. The June 6 - 8 conference, in Washington, DC, will focus on applications for Military, Aerospace, Space and Homeland Security (MASH 2006).
Arthur L. Chait, President and CEO of EoPlex, will present on Wednesday, June 7th. According to the presentation abstract, a great deal of research and development is being put into small form-factor, portable fuel cells. These micro fuel cells offer significant advantages as portable energy sources and battery recharging devices in a variety of industrial and defense applications. Broader adoption in portable consumer devices is also possible but depends on meeting tough economic, technical and regulatory requirements. These small fuel cells, and the reformers they may require, are special cases of a broader type of device known as micro-reactors. All of these micro-reactors represent unique challenges in both design and materials. They demand the ability to form complex 3-Dimensional structures and electrical interconnects, plus the ability to handle difficult, chemical and thermal requirements. EoPlex is a platform technology that produces these types of structures in a cost-effective process that can scale to meet high demand. The technology is called High Volume Print Forming™ (HVPF™). This presentation reviews the technology, and provides examples of the types of micro-reactors and 3-Dimensional structures possible.
The iMAPS 2006 Conference is considered to be the premier global forum exploring packaging issues and applications. More than 30 speakers from Europe, Asia, and the Americas are scheduled to participate.
About EoPlex
EoPlex Technologies Inc. is a Redwood City, CA company that produces miniature, complex electronic and structural components and systems through new technology that captures the speed and flexibility of printing and applies it to manufacturing. The EoPlex print forming process allows the manufacture of miniature 3-D systems with high precision and low cost at any volume of production. EoPlex can manufacture components and systems from a wide range of metallic, ceramic, glass and polymer materials. Complex shapes such as 3-D grids, interwoven circuits, assemblies containing multiple parts, and multiple material structures can be produced at the same time. The EoPlex process makes it cost effective to mass produce products that would be difficult or impossible to manufacture using conventional techniques. Identified market applications include: micro-reactors, fuel cells, energy harvesting devices, sensors, electronic components, and thermal management. The company is backed by Labrador Ventures, Draper Fischer Jurvetson, and Draper-Richards. For more information, visit http://www.eoplex.com or call 650.361.9070. Media contact, Janice Odell at 707.237.2738 or email at jan@fordodell.com.