Mr. Ron Sorisho joins EoPlex Technologies as VP Finance & Operations
Former contract manufacturing executive to lead Finance and Operations for EoPlex
South San Francisco, July 5, 2004 – EoPlex Technologies, Inc. announced today that Mr. Ron Sorisho has joined the company to lead Finance and Operations.
Prior to joining EoPlex, Mr. Sorisho was Chief Financial Officer of Smart Modular and Force Computers. These companies were divisions of Solectron Corporation and had revenues in excess of one billion dollars/year.
Prior to joining Solectron, Mr. Sorisho was Vice President of Finance & I.T. for Natsteel Electronics, an electronics contract manufacturer, headquartered in Singapore . During his tenure at Natsteel, he secured over $200 millions in capital resources to finance acquisitions in the U.S. Mr. Sorisho also was responsible for operations in the New Product Introduction (NPI) facility.
Before joining Natsteel, Mr. Sorisho was Director of Worldwide Finance and Operations for Adobe Systems. At Adobe he was responsible for $1.2 billion of revenue recognition, and channel management. Prior to Adobe, Mr. Sorisho was with National Semiconductor in operations, finance and international tax.
Mr. Sorisho holds a B.S. degree in Finance and Economics from San Jose State University .
Arthur L Chait, Chairman, CEO and President of EoPlex said “Ron brings to EoPlex a wealth of experience in both finance and manufacturing of electronics. He began working with us as a member of our Board of Advisors and put together both our financial model and manufacturing competitive analysis. Ron really knows how to make money in competitive situations and we’re delighted that he has decided to join the company as a member of the executive staff.”
About EoPlex
EoPlex
Technologies is a private
firm located in South
San Francisco that
has developed proprietary
systems for the production
of commercial volumes
of complex structures.
The firm’s High
Volume Print-Forming
TM process allows it
to create and mass-produce
3D structures for use
in electronic packaging,
wireless components,
microwave structures,
sensors, microstructures,
medical devices, and
biosensors.