Eoplex to Present at International Conference on Ceramic Interconnect and Microsystems Technologies (CICMT) April 12 and 13, Baltimore MD.
Redwood City, CA, Feb. 1 2005 – EoPlex Technologies, Inc., will present a technical paper and take part in a panel discussion at the upcoming CICMT conference in Baltimore Md.
Mr. Arthur L. Chait, Chairman, CEO and President will participate in the Global Business Council on April 12 th in a panel discussion on the “Business of Emerging Microsystems. Mr. Chait will then deliver a paper on April 13 th in the Microsystems, Materials and Fabrication session.
CICMT is under the joint sponsorship of the International Microelectronics & Packaging Society (IMAPS) and The American Ceramic Society (ACerS). The conference is considered to be the premier global forum on ceramic interconnect and ceramic Microsystems, two of the fastest growing areas of ceramic technology. Speakers for 13 different countries in Europe, Asia, and the Americas are scheduled to participate.
About EoPlex
EoPlex
Technologies Inc.,
is a Redwood City,
CA company that is
developing and commercializing
a family of new technologies
to manufacture miniature
electronic components.
The company is backed
by Labrador Ventures,
Draper Fischer Jurvetson,
and Draper- Ric hards.
EoPlex has developed
proprietary and patented
methods for high volume
production (High Volume
Print-Forming™ or
HVPF™) of three-dimensional
structures from a wide
range of metallic and
non-metallic materials.
Complex shapes such
as three-dimensional
grids, interwoven circuits,
assemblies containing
multiple parts, and
multiple material structures
can be produced at
the same time. The
EoPlex process makes
it cost effective to
mass-produce products,
which would be difficult
or impossible to manufacture
using conventional
techniques. Any shape
that can be computer
modeled or scanned
can be produced using
EoPlex processes. The
greatest cost advantage,
however, is with small
structures similar
in size to semiconductor
packaging. Identified
market applications
include: electronic
and optical packaging,
electronic components,
RF and microwave components,
medical devices, unique
3-D circuits, fuel
cells, batteries, mechanical
components, switches,
sensors and others.